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Meritech provides an end-to-end solution for Reliability and Burn-In requirements. Meritech’s engineering team and manufacturing team have accumulated technology and diverse experience through relationship with semiconductor industry around world for a long time.

All burn-in board, THB&HAST board and ESD/EOS board styles available.
DUT circuit modeling with simulation(Power SI)
Application Support
Impedance Controlled
Board design to Assembly.

Layer 2~22
Maximum Temperature 150℃
Maximum Humidity 85%
Board Materials FR4, High-Tg, Polyimide
Pitch. Min 0.35mm
Max Density 480
Target Device Memory, SOC
Socket Insert Type Socket Direct / Dut Board