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Tester : Catalyst, T2000(SOC), Ultra Flex, I-Flex, Flex, HP93000
Board Size(mm) : 580X404, 550X440, 406X406, 380X360
Thickness: ~ 7.5T
LAYER : 20~58L
Parallel : 1P~16P


[HPL]
1. Min. 0.35mm Pitch BGA.
2. Board Thickness 6.35T
3. Aspect. Ratio 32:1

( HPL+BVH+Back-Drill )

[ HPL + Back-Drill]
1. -100um Back-Drill
2. BVH after Back-Drill

(Board Section)

( Fill Via + IVH)

[Full Stack]
1. Min. 0.4mm Pitch BGA
2. High Speed Circuit.
3. Max. 14 Layer
4. Board Thickness 1.4T
5. 3N3, 2N2 IVH